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In connection with the growing demand for high-efficiency cooling modules for smartphones from major manufacturers, including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi, half of these modules were shipped in the second half of 2019, will represent solutions based on evaporative chambers. The remaining modules will use the technology of heat pipes. Moreover, it is expected that in 2020 the share of modules with evaporative camera will exceed the share of solutions with heat pipes. It is reported by the source, citing data from industry representatives.
this trend is caused by the increasing performance of smartphones and the emergence of models 5G. High processor speed and data transfer contributes to heat dissipation, so that the traditional solutions in the form of graphite sheets become insufficient. The solution on evaporation cells on average $ 2.50 more expensive solutions on heat pipes, but they are more effective. Currently reached a thickness of modules with evaporative camera is 0.3 mm, and the most popular are modules with a thickness of 0.4 mm.
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