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Toshiba Memory has announced the release of a new standard non-volatile memory XFMExpress designed for use in thin and light consumer electronics, ultrathin laptops, and IoT devices.
Using XFMExpress, you can solve the problem of maintainability thinnest and lightest devices in which solid state drive is rigidly fixed on the motherboard of the device and is not replaceable. An alternative to drives size M. 2 does not meet the requirements on thickness inherent in modern devices.
the Manufacturer said that XFMExpress does not compete with SD Express, because it is not a solution based on removable media and the internal storage device that is easy to replace. XFMExpress consists of two components: module XFMExpress, similar in size to SD card (14 x 18 x 1.4 mm), and connector developed by Toshiba in collaboration with JAE (Japan Aviation Electronics). In fact, the connector is an LGA contacts on the circuit Board and a steel clamping bracket.
On performance and capacity drives XFMExpress not differ from solid-state drives M. 2 NVMe, because they use the PCIe x4 and NVMe Protocol. By the way, this eliminates the need of additional drivers it is enough to support NVMe. Now the standard is integrated using the PCIe 3.0 x4, but "very soon" will have PCIe 4.0 x4. Module design XFMExpress includes controller, cache memory, DRAM and the flash memory 3D NAND.
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